Research on Virtual Instrument for Thermal Deformation Detection of Machine Tools

Research on Virtual Instrument for Thermal Deformation Detection of Machine Tools

With the development of precision and ultra-precision machining technology and the emergence of automated machining systems, people have put forward higher requirements on the precision of metal cutting machine tools. Statistics show that the manufacturing error caused by thermal deformation of machine tools accounts for 40%~70 of the total error. %, and the variation law of the main heat source causing thermal deformation of the machine tool is complicated, and the machining error caused by it is difficult to identify and compensate. With the development of modern computer technology and detection technology, the research on thermal deformation of machine tools can be raised to a new height. Virtual instrument is a new generation instrument after analog instrument, discrete component instrument, digital instrument and intelligent instrument. It is a new concept instrument that combines computer technology with instrument technology. It is a revolution in the field of instrumentation. The main heat source of the milling and boring machine comes from the thermal deformation of the spindle box, which causes the thermal displacement and thermal tilt of the machine tool spindle. The author uses the virtual instrument technology to develop a virtual instrument system for the thermal deformation detection of the spindle head of the machine tool.

2 hardware system constitutes the hardware composition of the virtual instrument generally has four options, as shown in Figure 1.

I measurement and control object h ~! Signal conditioning! ! Data acquisition film | ~M serial port instrument -> 1 computer / 1 station? 1 virtual instrument system composition block diagram In the development of virtual instrument system for machine tool spindle thermal deformation detection, considering the flexibility and economy of the system , using a data acquisition card structure. The system includes eddy current displacement sensors, signal conditioners, data acquisition cards, microcomputers and peripherals. The system structure is shown in Figure 2.

Liu Kang. Introduction to Bluetooth Technology IJ. Jiangsu Communication Technology End 2001 (4).

2 Li Meng, Xiong Mingquan. Introduction to Bluetooth Technology | J Communications World 2000 (1).

Internal RF transceiver (upper page 37), advanced testing and other advanced technologies in a multi-language mixed software to achieve multiple functions, both high cost performance, short development cycle, and friendly Human-machine interface, good maintainability, development and scalability. In addition to the machine-related parameter detection involved in the text, the system can also use the same PC and the same acquisition card to virtually generate a variety of traditional instruments and modern 14 intelligent measurement and control systems to meet the needs of specific measurement and control. I51

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